Master Bond EP114 is a two-component, low viscosity, NASA low outgassing rated, heat-cured epoxy that can be effectively utilized for underfill, coating, impregnating, and porosity sealing applications. This optically clear compound features high dimensional stability due to its nano-silica filler material. It has been successfully tested for abrasion resistance per ASTM D4060-14 and readily withstands…
Epoxy Certified for UL 1203 Standard
UL 1203 certified epoxy for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous Locations By Master Bond Underwriters Laboratories (UL) 1203 is defined as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”. To certify an epoxy for the UL1203, sample castings are exposed to saturated vapors in air…
High strength, NASA low outgassing approved epoxy
Supreme 10HT has demonstrated superior strength properties, proven by several research studies. Master Bond Supreme 10HT has demonstrated superior strength when used to bond surfaces under challenging conditions. It is a toughened system that is cryogenically serviceable from 4K to 400°F. It withstands mechanical and thermal shocks, meets NASA low outgassing specifications, and withstands 1,000…
Nanosilica filled, dual cure adhesive: See how Master Bond UV22DC80-1 cures in this video demonstration and learn more about its performance properties
UV22DC80-1 is an abrasion resistant adhesive system with superior dimensional stability, very low shrinkage upon cure, and optical clarity. It meets NASA low outgassing specifications. By Rohit Ramnath, Sr. Product Engineer, Master Bond Inc. Master Bond UV22DC80-1 is a nanosilica filled, dual cure epoxy based system. Nanosilica filled epoxy formulations are designed to further improve…
No Mix, thermally conductive, electrically insulative Epoxy for underfill applications
Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10…
Advanced epoxy adhesives revolutionize structural bonding
by Walter Brenner, PhD, Founder, Master Bond Inc. Structural polymers offer distinct advantages over traditional fastening methods. Here, we explore the cornerstones of successful structural bonding. Structural bonding is defined as the process of joining parts together using an adhesive as opposed to conventional mechanical fasteners or assembly methods such as soldering, brazing or welding.…
Epoxy adhesive has ultra low thermal resistance, meets NASA low outgassing specifications
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m·K)].…
Enhance Electronic Performance with Epoxy Compounds
by Venkat Nandivada, Manager, Technical Sales, Master Bond Offering a nearly limitless assortment of end properties, epoxy systems enable higher density semiconductor electronics and economical, as well as enhanced reliability, while improving manufacturing efficiencies. Today’s high performance electronic circuits that are designed into compact assemblies must meet a host of engineering requirements to ensure the…
Dimensionally Stable Epoxy Based UV Curable System with High Temperature Resistance
Master Bond UV15 is widely used for a variety of bonding, coating and sealing applications in the optical, electronic and optoelectronic industries. This epoxy based UV curable system is 100% reactive and does not contain any solvents or other volatiles. It is also completely free of any oxygen inhibition. Master Bond Electrically Insulative Adhesives Master Bond…